STANNOL mulifix450-01無鹵素環(huán)保助焊膏，專門用于手機、主板維修等。 *殘留物極低，焊后殘留物基本揮發(fā)掉。阻抗高，焊后無需清洗。 *焊后不氧化，阻值高。不含鹵素(F/CL/Br/I)物質(zhì)等優(yōu)點。 *本膏體黏度低，顆粒度微細，一般在20-30μm。
*完全代替市面上所有維修手機、主板的各類助焊膏。
Stannol mulifix 450-01 specially developed to rework and repair. It is a kind of resin matrix, not clean, flux, suitable for manual and automatic allocation, has good printing eligibility and good dispensibility. Very low activation energy flux residue in produce good insulation reaction after welding. To plastic 450-01 fast dry residue, not sticky.