☆均取得原廠**授權(quán)，可安心使用，無侵權(quán)疑慮。
I started by raw materials and melting manufacturing, R & D and production according to customer needs and. I developed the patented production equipment, BGA solder ball can produce high-quality 0.035mm~0.889mm, applicable to the semiconductor and packaging related industry required. It adopts antistatic packaging material, can be avoided due to electrostatic and even in the bottle, the use of trouble. <0.2mm, super ball vacuum aluminum foil packaging. I have authorized the original patent infringement, can feel at ease to use, no doubt.